ASUS Republic of Gamers NUC gaming PC

The first-ever ROG NUC PC for AAA gaming

Acer launches new line of TravelMate

A new range of AI-enhanced business laptops

LG new tone free wireless earbuds

The new T90S earbuds enhanced by pure graphen

Lenovo launched the Lenovo ThinkPad P14s

Optimized performance in AI workflows

Kingston leads channel SSD market

Capturing a 23.8% share of the channel SSD market in 2023

June 2, 2026

WD at Computex 2026: AI Doesn't Just Run on Compute - It Runs on Data

Western Digital Corporation (Nasdaq: WDC), the storage foundation of the AI-driven data economy, today announced its presence at Computex 2026 to help the industry understand that AI infrastructure is fundamentally a data system, not just a compute system. Every AI workload - from training and inference to agentic and physical AI – continuously creates data that persists, compounds, and expands over time. This dynamic is fundamentally changing how businesses must design AI infrastructure for scale.

This shift exposes the core challenge for AI builders: managing exponential data growth while maintaining performance and economic efficiency at scale. How that data is managed determines whether AI delivers lasting business value or becomes an unsustainable cost. WD is at Computex addressing this reality with a forum session keynote, booth demonstrations and new storage innovations.



WD Chief Product Officer Ahmed Shihab will discuss why AI infrastructure can no longer be designed primarily around compute performance, and why persistent data growth, tiered architectures, and infrastructure economics are becoming the defining constraints of AI at scale.

“The shift toward AI-driven workloads is placing new demands on storage systems, requiring higher throughput, greater capacity, and improved reliability across multiple tiers,” said John Chen, Vice President at TRENDFOCUS. “WD’s advancements in HDD and platform technologies reflect the kinds of innovations needed to support increasingly data-intensive AI environments at scale.”

WD's exhibit brings this data-centric architecture to life, demonstrating how storage underpins AI systems at scale. Visitors will see WD's Ultrastar® HDD high-capacity storage portfolio spanning UltraSMR, ePMR and HAMR. The company will also be highlighting its two industry-first advanced HDD innovations: High Bandwidth Drive Technology and Dual Pivot Drive Technology, which together project a 4x increase in HDD throughput while maintaining the relative I/O per TB rate customers enjoy today. This reduces the need for customers to increase SSD deployment or rearchitect services as capacity scales.

WD’s Platform solutions highlighted will include the Ultrastar Data Series JBODs, OpenFlex® EBOF, and RapidFlex® NVMe-oF™ controller. These solutions help cloud, neo cloud and HPC companies accelerate adoption by optimizing capacity and performance, reducing costs, and improving time to value without requiring costly infrastructure designs. WD is also showcasing its new Ultrastar Data 3000 series JBODs, delivering the scalable capacity required for AI data growth. Using ArcticFlow™ multizone cooling and patented IsoVibe™ vibration isolation technologies, the Ultrastar Data 3000 series optimizes performance and reliability by reducing drive return rates by up to 62%1 in a platform designed for dependable operation at scale. The 3000 series also offers 12 ports of 24 Gb/s SAS‑4 host connectivity, enabling customers to stay ahead of bandwidth demands as capacity and workload intensities grow.

WD will also share tiered storage solutions, including architectures built on Ceph and others developed with IBM® Storage Scale and XTAO, that align performance and economics to each stage of the AI data lifecycle, increasing GPU efficiency while lowering cost at scale through tiered system-level architectures.

The globally recognized WD Color portfolio including WD Gold®, WD Red®, and WD Purple®, as well as the rebranded G-DRIVE® family of external storage solutions designed for content creators, will also be on display.

Together, these innovations position WD as a key foundational layer in AI infrastructure, enabling the persistence, movement, and scalability of data across environments.

“Computex is a great opportunity to connect with AI leaders and builders from around the world at a pivotal moment for the industry,” said Stefan Mandl, Vice President of Worldwide Sales and Marketing at WD. “AI is driving data growth at a scale and pace the industry has never seen before, and the organizations that recognize AI as a data system are the ones that will build AI that scales economically and efficiently over the long term. WD provides the durable, scalable and economically efficient data infrastructure foundation required to support AI systems over the long term.”

May 21, 2026

Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

Cadence (Nasdaq: CDNS) today announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for real-time perception and autonomy.


Lidar technology enables precise 3D mapping and object detection in robotics, autonomous vehicles, industrial automation and other physical AI applications at the edge. Its ability to deliver high-resolution depth information makes it indispensable for safety and navigation. Aeva’s 4D LiDAR technology goes a step further by detecting velocity and position simultaneously, empowering autonomous devices to make safer, more intelligent decisions.

Cadence Tensilica Vision DSPs deliver a unique combination of programmability and performance, enabling Aeva to add flexibility, scalability and customizations to the lidar processing pipeline. Their inherent low-power architecture and customizable Tensilica Instruction Extension (TIE) language make Tensilica DSPs ideal for real-time signal processing, where latency and efficiency are critical.

“Cadence’s DSP technology provides the flexibility and performance uplift we need to push the boundaries of perception and deliver scalable solutions to our industrial and automotive customers,” said James Reuther, chief engineer of Aeva. “By integrating the Tensilica Vision DSP into our next-generation LiDAR systems, Aeva can leverage the powerful combination of Cadence’s highly configurable hardware and comprehensive suite of optimized software libraries to accelerate innovation and bring advanced sensing capabilities to market faster.”

“Cadence is committed to enabling our customers to build smarter, safer and more connected systems for edge and physical AI applications, and we look forward to collaborating with Aeva to redefine perception with their groundbreaking 4D LiDAR technology,” said Amol Borkar, group director of product management and marketing for Tensilica DSPs at Cadence. “Our Tensilica DSPs empower SoC providers to deliver differentiated performance and power efficiency in leading-edge, low-latency applications like lidar.”

Aeva is the latest in a growing list of companies leveraging Tensilica Vision DSPs to drive innovation across industrial robotics, autonomy and other physical AI applications. Tensilica Vision DSPs come with industry-leading software libraries optimized for neural networks, computer vision, simultaneous localization and mapping (SLAM), radar and point cloud processing. In addition, Tensilica DSPs are equipped with a third-generation neural network compiler, the NeuroWeave SDK, which enables execution of the latest AI networks proliferating in the lidar segment. With a proven track record in ADAS, radar, audio and vision processing, Tensilica DSPs remain the go-to solution for high-performance, low-power and customizable processor IP.


May 20, 2026

Sony Unveils the FE 100-400mm F4.5 GM OSS G Master™ Super-Telephoto Zoom Lens

Sony Electronics introduces the FE 100-400mm F4.5 GM OSS, the newest addition to its flagship G Master™ lens series for full-frame Alpha™ E-mount cameras. Covering a 100-400 mm focal range with a constant F4.5 aperture, the lens delivers the exceptional resolution and bokeh that define the G Master series, high-precision autofocus (AF) up to approximately 3x faster1,2 than the FE 100-400mm F4.5-5.6 GM OSS. Weighing approximately 65 oz. (1,840 g) with an internal zoom structure, its stable weight balance offers highly mobile shooting capabilities. The FE 100-400mm F4.5 GM OSS gives wildlife, birding, sports, and photojournalism creators the speed, reach, and image quality to capture decisive moments in any environment, expanding their creative possibilities.


Uncompromising G Master Optics

  • Resolves fine detail across the full 100-400 mm zoom range, even wide open at F4.5
  • Optical design featuring newly developed ED XA (Extra-low Dispersion extreme aspherical), XA (extreme aspherical), two Super ED (extra-low Dispersion), and three ED glass elements, effectively controlling multiple aberrations including chromatic and spherical aberration to achieve exceptional resolution from centre to edge across the entire zoom range
  • Nano AR Coating II reduces ghosting and flare for high-contrast results in backlit conditions
  • 11-blade circular aperture with precision spherical aberration control produces the signature G Master bokeh
  • Constant F4.5 maximum aperture eliminates exposure shifts while zooming
  • Compatible with optional teleconverters[i] for focal lengths up to 800 mm or 1,200 mm in APS-C mode[ii]

 Autofocus That Keeps Pace with the Action

  • Four custom-optimized XD (extreme dynamic) Linear Motors, a floating focus mechanism, and the latest AF algorithms deliver AF speeds up to 3x faster1,2 with approximately 50 % improved subject tracking2
  • Fully compatible with Alpha 9 III continuous shooting at up to 120 fps[iii] with AF/AE tracking

Lightweight Build, Exceptional Mobility

  • Combining the latest optical design, mechanical engineering with lightweight yet robust magnesium alloy barrel components, and high-efficiency, high-thrust XD Linear Motors, the lens achieves a lightweight and robust body at approximately 65 oz. (1,840 g)
  • Inner-zoom design maintains constant length and stable centre of gravity throughout the zoom range for precise framing adjustments without shifting balance

Professional-Grade Control and Reliability

  • Built-in stabilization supports Active Mode and coordinates internal stabilization control on compatible bodies
  • Supports the camera body’s breathing compensation[iv], correcting angle-of-view shifts during focus adjustments in video recording
  • Four focus hold buttons[v] and a dedicated function ring for intuitive, personalized operation in the field
  • Dust and moisture resistant design[vi] with fluorine front-element coating maintains reliable performance in challenging conditions

Availability

The FE 100-400mm F4.5 GM OSS will be available from May 2026 with the SRP of RM17,999.

MINIX to Debut Next-Gen AI PCs Across NVIDIA, Intel, and AMD Platforms at COMPUTEX 2026

Hardware pioneer MINIX has announced its official participation in COMPUTEX TAIPEI 2026, where it will showcase an aggressive new lineup of next-generation AI PCs and professional small-form-factor systems. Exhibiting from June 2–5 at the Taipei Nangang Exhibition Center, the ultra-compact computing specialist is positioning itself at the cutting edge of the industry's pivot toward local AI processing. The upcoming hardware showcase will span multi-platform ecosystems across NVIDIA, Intel, and AMD architectures, focusing on bringing high-performance neural processing power directly to the desktop and edge environments.


Innovation Highlights at Minix Computex Booth
Visitors to the MINIX booth will experience a diverse portfolio of hardware engineered for the future of intelligent automation and creative workflows:

  • AI PCs Powered by NVIDIA: Experience the peak of accelerated computing. These units leverage NVIDIA’s advanced Tensor Cores to handle intensive AI generation, rendering, and deep learning tasks in a compact footprint.
  • AI PCs Powered by Intel: Discover versatility and reliability. Featuring the latest Intel® Core™ Ultra processors with integrated NPUs, these PCs are built for seamless AI integration in professional and everyday environments.
  • AI PCs Powered by AMD: High-performance meets extreme efficiency. Optimized for multi-threaded AI workloads, these mini-PCs offer exceptional power-to-size ratios for demanding users.
  • Ultra-Compact Mini PCs (Non-AI): Our signature silent-operation desktops. Ideal for digital signage, office productivity, and embedded industrial applications where low power consumption is paramount.
  • Professional Displays & Accessories: A suite of high-performance monitors, touchscreen panels, and advanced docking solutions designed to create a unified, high-efficiency ecosystem.
Redefining the Edge
From home entertainment and creative studios to industrial edge computing, MINIX solutions are engineered to be powerful, silent, and incredibly small. Our 2026 lineup demonstrates how AI capability is no longer reserved for massive towers, but can now live right at your fingertips.


May 18, 2026

Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for real-time perception and autonomy.


Lidar technology enables precise 3D mapping and object detection in robotics, autonomous vehicles, industrial automation and other physical AI applications at the edge. Its ability to deliver high-resolution depth information makes it indispensable for safety and navigation. Aeva’s 4D LiDAR technology goes a step further by detecting velocity and position simultaneously, empowering autonomous devices to make safer, more intelligent decisions.

Cadence Tensilica Vision DSPs deliver a unique combination of programmability and performance, enabling Aeva to add flexibility, scalability and customizations to the lidar processing pipeline. Their inherent low-power architecture and customizable Tensilica Instruction Extension (TIE) language make Tensilica DSPs ideal for real-time signal processing, where latency and efficiency are critical.

“Cadence’s DSP technology provides the flexibility and performance uplift we need to push the boundaries of perception and deliver scalable solutions to our industrial and automotive customers,” said James Reuther, chief engineer of Aeva. “By integrating the Tensilica Vision DSP into our next-generation LiDAR systems, Aeva can leverage the powerful combination of Cadence’s highly configurable hardware and comprehensive suite of optimized software libraries to accelerate innovation and bring advanced sensing capabilities to market faster.”

“Cadence is committed to enabling our customers to build smarter, safer and more connected systems for edge and physical AI applications, and we look forward to collaborating with Aeva to redefine perception with their groundbreaking 4D LiDAR technology,” said Amol Borkar, group director of product management and marketing for Tensilica DSPs at Cadence. “Our Tensilica DSPs empower SoC providers to deliver differentiated performance and power efficiency in leading-edge, low-latency applications like lidar.”

Aeva is the latest in a growing list of companies leveraging Tensilica Vision DSPs to drive innovation across industrial robotics, autonomy and other physical AI applications. Tensilica Vision DSPs come with industry-leading software libraries optimized for neural networks, computer vision, simultaneous localization and mapping (SLAM), radar and point cloud processing. In addition, Tensilica DSPs are equipped with a third-generation neural network compiler, the NeuroWeave SDK, which enables execution of the latest AI networks proliferating in the lidar segment. With a proven track record in ADAS, radar, audio and vision processing, Tensilica DSPs remain the go-to solution for high-performance, low-power and customizable processor IP.